KEY JOB DUTIES & RESPONSIBILITIES: Process Owner responsible for managing the Surface Mount Technology (SMT) line at Prime. •Develop processes to ensure process control for high volume, high yield, and optimum efficiency •Enhance Traceability system and Shop Floor Control to monitor, archive, and control critical component and process information •Develop processes for automation and remove manual handling and manual data input •Hands-on knowledge in solder paste printing, stencil design, component placement, fiducial alignment, N2 reflow, No clean, burn-in procedures, cleanliness inspection methodology, double sided reflow, mechanical routing, and rework/repair •Expert in Chip Scale Packaging (CSP), Flip Chip & underfill, Chip on Board (COB), Chip on Flex (COF), micro SMDs, 0201 & 01005 placement, QFNs, BGA rework, ICT, and AOI •Experience with 5DX X-ray (3D), 2D X-ray, and XRF (RoHS compliance) •Handle all customer visits, line tours, and audits (in English) SKILLS/QUALIFICATIONS: •Minimum 7 years in high volume, high density SMT process development •BS/MS/PhD Engineering Degree •IPC 600 & 610, 6 sigma, Lean manufacturing, SPC, DOE, PFMEA, FMEA, and GR&R training and certification preferred. •ISO 9k & 14k, and TL-9000 background a plus •Familiar with IPC procedures (eg IPC 9701) Excellent communication skills, both written and oral English